Signal layer interconnects
US7348494B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2001 |
| Grant date | Mar 25, 2008 |
| Priority date | — |
| Expiry date | Apr 3, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10598
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Inner layer traces on a multilayer printed wiring board are exposed to enable direct interconnection with another device such as a printed wiring board. The traces may be exposed by removing at least some of the dielectric substrate material around the traces, or by extending the traces beyond the other layers of the printed wiring board. Corresponding conductors associated with the other device are placed in direct physical contact with the exposed inner layer traces, and may be aligned and secured with guide plates, alignment pins and spring members. Such direct connection mitigates the need for vias, and has more favorable electrical characteristics for high frequency signal transmission.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.