Partially voided anti-pads
US7348498B2 · kind B2 · utility
7Cited by
12References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2003 |
| Grant date | Mar 25, 2008 |
| Priority date | — |
| Expiry date | Jan 9, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49156
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board comprises a conductive layer and a via transecting the conductive layer. The printed circuit board comprises a pattern of conductive material having a plurality of voids in the conductive layer near the via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.