Multi-substrate RF module for wireless communication devices
US7348842B2 · kind B2 · utility
33Cited by
7References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2006 |
| Grant date | Mar 25, 2008 |
| Priority date | — |
| Expiry date | Aug 30, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/041
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A radio frequency (RF) module includes a first substrate adapted to receive passive circuits; and a second substrate adapted to receive active circuits, the first and second substrates electrically coupled through pads positioned on opposing surfaces of the first and second substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.