RFIDs embedded into semiconductors
US7348887B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 15, 2005 |
| Grant date | Mar 25, 2008 |
| Priority date | — |
| Expiry date | Apr 26, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06K19/07798
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a RFID device comprising a radio frequency identification (RFID) transceiver and antenna element co-located with a semiconductor device, a method for making same and a method of using the RFID device of the present invention to locate, track and identify semiconductor devices and the devices they reside in. One embodiment of the RFID device of the present invention comprises a radio frequency identification (RFID) transceiver embedded within packaging of a semiconductor device. A second embodiment of the RFID device of the present invention comprises a radio frequency identification (RFID) transceiver as a separate circuit block within the semiconductor device. A third embodiment of the RFID device of the present invention comprises a radio frequency identification (RFID) transceiver as a separate independent circuit on top of the semiconductor device, System on Chip (SoC). These RFIDs can also be nested within an enclosure, or combined to increase the address length of the RFID.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.