Heat dissipation device
US7349212B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 24, 2006 |
| Grant date | Mar 25, 2008 |
| Priority date | — |
| Expiry date | Sep 13, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation device includes a heat sink having a plurality of fins defining a plurality of passageways therebetween. The passageways have an inlet and an outlet at two sides of the heat sink. A fan is located at the inlet of the passageways of the heat sink for providing airflow to the heat sink. A guiding member is positioned at the outlet of the passageways of the heat sink for guiding the airflow to electronic components around the heat dissipation device. The heat sink defines a slot at a side thereof, the guiding member extends at least a fixing arm fixed to the heat sink and a tongue embedded into the slot of the heat sink, thereby attaching the guiding member to the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.