System for memory hot swap
US7350089B2 · kind B2 · utility
4Cited by
5References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2005 |
| Grant date | Mar 25, 2008 |
| Priority date | — |
| Expiry date | Jun 27, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F11/073
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A system may include a motherboard, a chipset coupled to the motherboard, a memory module mount coupled to the chipset, a power transistor electrically coupled to the memory module mount, a voltage regulator to provide power to the power transistor, and an I/O expander coupled to the motherboard. The I/O expander is to receive instructions from the chipset to selectively control the power transistor to provide the power to the memory module mount.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.