Compression device for integrated circuit packages
US7350290B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 12, 2004 |
| Grant date | Apr 1, 2008 |
| Priority date | — |
| Expiry date | Dec 29, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53283
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A compression device has a frame sized to accept an integrated circuit package and a pressor. The frame includes a surface defining an opening with an axis and at least one ramp extending from the surface. The ramp or ramps have upper and lower flat portions, substantially parallel with a plane perpendicular to the axis, and a sloped portion at an angle relative to the plane, the sloped portion connecting the upper and lower flat portions. The pressor is configured to engage the ramp and rotate in response to applied force. When the pressor is engaged with the sloped portion(s) of the ramp(s), this rotation causes movement of the pressor along the axis. However, when engagement between the ramps and the pressor is in the flat portions of the ramp, continued movement of the pressor along the axis is limited in spite of any continued rotation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.