Method of electroplating a plurality of conductive fingers
US7350294B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 27, 2006 |
| Grant date | Apr 1, 2008 |
| Priority date | — |
| Expiry date | Mar 4, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of electroplating may include placing a pair of conductive fingers in proximity to an edge of a circuit board, where the pair are coupled to be electrically isolated, and where the pair are substantially longitudinally oriented away from the edge. A trace electrically couples the pair of conductive fingers via a shortest path between the pair of conductive fingers. A plating bar is electrically coupled to one of the pair of conductive fingers and thereafter electroplating the pair of conductive fingers via the plating bar. Subsequent to electroplating, laser drilling the trace to electrically isolate the pair of conductive fingers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.