Method for reducing socket warpage
US7350299B2 · kind B2 · utility
2Cited by
17References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 15, 2004 |
| Grant date | Apr 1, 2008 |
| Priority date | — |
| Expiry date | Jan 15, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53174
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and a structure for reducing socket warpage in an embodiment by forming at least one groove in a socket housing contiguous to a surface mount region for an electrical device and securing a rigid bar in the groove.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.