Image sensor module architecture
US7350712B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2005 |
| Grant date | Apr 1, 2008 |
| Priority date | — |
| Expiry date | Mar 31, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06K7/10732
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Image sensor module architecture provides flexible mounting of illuminators in an imaging apparatus with flexible fasteners. The architecture involves one or more LED-based illuminators that may be mounted adjustably to provide high intensity and uniform profile luminescence. The supporting imaging and electronic circuit components are quickly assembled and disassembled from the image sensor module by using a flexible multi-function clip having multiple segments for holding multiple objects together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.