Method and apparatus for applying particulate material to a substrate
US7351287B2 · kind B2 · utility
2Cited by
8References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2006 |
| Grant date | Apr 1, 2008 |
| Priority date | — |
| Expiry date | Jun 21, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1798
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method and apparatus of applying a particulate material to a substrate includes applying adhesive to the substrate and passing the substrate through a chamber in which a particulate material is suspended in a fluid in order to adhere the particulate material to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.