Assembly for processing substrates
US7351292B2 · kind B2 · utility
3Cited by
9References
55Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 21, 2003 |
| Grant date | Apr 1, 2008 |
| Priority date | — |
| Expiry date | Jun 3, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/139
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An assembly for processing substrates, which processing comprises a vacuum deposition process, such as, for instance, sputtering, CVD or PECVD, which vacuum deposition process is carried out in at least one process chamber, the assembly being provided with a conveying device for moving the substrates from a vacuum lock to a process chamber, the conveying device, which extends in a vacuum space, permitting a continuous conveyance of a substrate adjacent the at least one process chamber and permitting an intermittent conveyance adjacent at least the at least one vacuum lock.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.