Method and apparatus for reducing surface defects
US7351304B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 24, 2005 |
| Grant date | Apr 1, 2008 |
| Priority date | — |
| Expiry date | Sep 7, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1944
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A removal assembly and method for removing a submaster from a master is described. A curved tooling surface is arranged within a housing of the assembly. A first array of vacuum cups is attached to the housing adjacent a first end of the curved tooling surface, where the first array of vacuum cups are configured to provide a vacuum grip on a first portion of the submaster. A second array of vacuum cups is attached to the housing adjacent a second end of the curved tooling surface, where the second end opposes the first end, the second array of vacuum cups is configured to provide a vacuum grip on a second portion of the submaster. A rotation mechanism is configured to rotationally support the master as the master is rolled along the curved tooling surface to remove the submaster.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.