Methods and devices for enhancing bonded substrate yields and regulating temperature
US7351377B2 · kind B2 · utility
114Cited by
24References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2001 |
| Grant date | Apr 1, 2008 |
| Priority date | — |
| Expiry date | Dec 24, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB01L2400/0415
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Methods and devices that include the use of venting elements for enhancing bonded substrate yields and regulating temperature. Venting elements are generally fabricated proximal to functionalized regions in substrate surfaces to prevent bond voids that form during bonding processes from affecting the functionalized regions. Venting elements generally include venting channels or networks of channels and/or venting cavities.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.