Spunbond facing and faced insulation assembly
US7351459B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 4, 2006 |
| Grant date | Apr 1, 2008 |
| Priority date | — |
| Expiry date | Oct 4, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24322
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
A faced building insulation assembly includes a first facing forming a first major surface of the assembly with a central field portion having one or more spunbond continuous polymeric filament mat layers. Preferably, the facing is fungi growth resistant and has a selected water vapor permeance rating as applied to an insulation layer of the assembly. The facing may also include one or more polymeric film layers, a fungi growth inhibiting agent, a pesticide, and/or a heat activated bonding agent that bonds the facing to the insulation layer of the assembly. The insulation assembly may also include a second facing forming a second major surface of the assembly that has a water vapor permeance rating equal to or differing from the first facing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.