Control circuits for hot melt adhesive heater circuits and applicator heads
US7351937B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 2, 2006 |
| Grant date | Apr 1, 2008 |
| Priority date | — |
| Expiry date | Feb 2, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05C11/1042
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electronic control circuit, for use in connection a hot melt adhesive dispensing system having a relatively large applicator head, has a plurality of heater circuits and a plurality of temperature sensors disposed upon different regions of the relatively large applicator head, wherein the electronic control circuitry can effectively interface between the plurality of heater circuits and the plurality of temperature sensors, and the adhesive supply unit (ASU) hose and head connector, so as to control individual ones of the plurality of heater circuits and thereby ensure that all of the heater circuits will maintain the same temperature setting throughout all regions of the applicator head. A second electronic control circuit enables the temperature sensors to effectively be eliminated due to the fact that the temperature value of each heater circuit can be calculated from resistance and temperature coefficient values characteristic of the heater circuit, wherein the electronic control circuitry can again interface between the heater circuit and the adhesive supply unit (ASU) temperature controller.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.