Stacked semiconductor device
US7352067B2 · kind B2 · utility
23Cited by
2References
15Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jun 27, 2005 |
| Grant date | Apr 1, 2008 |
| Priority date | — |
| Expiry date | Aug 27, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A stacked semiconductor device includes a plurality of semiconductor chips and a conductive path extending through at least one of the semiconductor chips. The semiconductor chips are stacked together. The semiconductor chips are electrically connected by the conductive path, and the conductive path has a plurality of through-connections extending through the corresponding semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.