Sensor assembly and method of forming the same
US7352191B2 · kind B2 · utility
1Cited by
20References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 4, 2005 |
| Grant date | Apr 1, 2008 |
| Priority date | — |
| Expiry date | Apr 4, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49174
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
A sensor assembly includes a sensing element electrically connected to a conductor of a flexible multiconductor cable using a conductive patch, which is electrically connected to the conductor. A method of forming a sensor assembly includes electrically connecting an electrically conductive patch to a sensing element and electrically connecting a conductor of a multiconductor cable to the electrically conductive patch.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.