Assembly and heat-dissipating device having the same assembly
US7352574B2 · kind B2 · utility
8Cited by
9References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 27, 2006 |
| Grant date | Apr 1, 2008 |
| Priority date | — |
| Expiry date | Apr 28, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/20
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An assembly and a heat-dissipating device having the same assembly are provided, in that tapped holes in fans of the heat-dissipating device are used with at least two columnar first fixing parts for mounting or detaching the heat-dissipating device with the need for extra tools. Accordingly, problems in the prior art may be solved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.