Liquid-cooled heat dissipation module
US7352577B2 · kind B2 · utility
4Cited by
7References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2005 |
| Grant date | Apr 1, 2008 |
| Priority date | — |
| Expiry date | Sep 22, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A liquid-cooled heat dissipation module for circularly dissipating heat from a heat source. The liquid-cooled heat dissipation module includes a fan having a base; a pump disposed on the base; a heat sink coupled to the fan and having an opening to receive the pump; and a guide part disposed in the opening of the heat sink, communicated to the pump and having an outer surface, a through hole and a guide passage formed on the outer surface. The pump drives a working fluid in the liquid-cooled heat dissipation module to pass through the through hole, the pump and the guide passage to circularly dissipate heat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.