Cooling device and electronic apparatus
US7352581B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 23, 2006 |
| Grant date | Apr 1, 2008 |
| Priority date | — |
| Expiry date | Jun 23, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
According to one embodiment, a cooling device includes: a heat transfer unit thermally connected to a mounted first heating element and a mounted second heating element whose mounted height is higher than that of the first heating element, the heat transfer unit including a passage through which a coolant circulates, a heat-receiving section having a first portion thermally connected to the first heating element and a second portion thermally connected to the second heating element, a heat-sinking section that dissipates heat received by the heat-receiving section, a first plate member in which is formed a first groove corresponding to the passage, and a second plate member that covers the first groove. The heat-receiving section is formed at least one of the first and second plate members.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.