Method for assembling micro structures
US7353593B2 · kind B2 · utility
0Cited by
8References
39Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 9, 2003 |
| Grant date | Apr 8, 2008 |
| Priority date | — |
| Expiry date | Jan 30, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49137
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method for making three-dimensional structures comprises providing a plurality of components, each of which is moveably coupled to a substrate. The components may be pivotally coupled to the substrate by one or more micromachined hinges. The components are moved using electrostatic forces which lift the components from the surface of the substrate. The components may then be moved further by providing electrostatic forces between components. Two or more components may engage with one another to provide a three-dimensional structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.