Diffusion bonding for metallic membrane joining with metallic module
US7353982B2 · kind B2 · utility
16Cited by
14References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 25, 2003 |
| Grant date | Apr 8, 2008 |
| Priority date | — |
| Expiry date | Oct 28, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/50
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
This invention relates to a method of bonding a metallic membrane with metallic part involving pressing a smooth surface of the metallic membrane against the smooth surface of the metallic part, and heating the metallic membrane and metallic part to a temperature above the half melting point of the metallic membrane while subjecting the metallic membrane and metallic part to a controlled environment of a proper gas atmosphere. The metallic membrane can comprise palladium and the pressurized gas can comprise one of hydrogen, an inert gas or their mixture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.