Film deposition device
US7354482B2 · kind B2 · utility
307Cited by
3References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2004 |
| Grant date | Apr 8, 2008 |
| Priority date | — |
| Expiry date | Oct 9, 2025 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/52
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A film deposition device for depositing a film includes a depositing chamber for depositing the film with plasma. A plasma quantity monitoring device is disposed in the depositing chamber for monitoring a plasma quantity entering the depositing chamber at real time. A calculating device is electrically connected to the plasma quantity monitoring device for calculating a thickness of the film from the plasma quantity so that the thickness is monitored at real time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.