Palladium alloy
US7354488B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 10, 2005 |
| Grant date | Apr 8, 2008 |
| Priority date | — |
| Expiry date | May 10, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01H1/023
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A family of alloys for use in medical, electrical contact and jewelry applications includes as primary components palladium, and boron and at least one of ruthenium, rhenium, platinum, gold, zirconium, tungsten, cobalt, nickel, tantalum and iridium. An alternative embodiment includes palladium and rhenium and/or ruthenium with an additional element iridium, platinum, tungsten, boron, gold, zirconium, cobalt, nickel and tantalum. The present alloy family has a high strength, high radio opacity, and biocompatibility characteristics, while also being workable into various configurations. Where required, some of the alloys also offer post form, heat treatment (age hardening) capabilities for even higher hardness and strength levels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.