Processing method for glass substrate, processed glass product and stress applying apparatus
US7354526B2 · kind B2 · utility
2Cited by
4References
18Claims
0Family size
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Key dates
| Filing date | Nov 19, 2004 |
| Grant date | Apr 8, 2008 |
| Priority date | — |
| Expiry date | May 25, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24355
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A processing method for glass substrate of the present invention includes: applying heat and external force to a glass substrate and then cooling it down to thereby form a compression stressed part having a different etching rate from that of other parts with respect to an etching reagent to be used, on the surface of the glass substrate and in the vicinity thereof, and performing chemical etching using the etching reagent on the glass substrate having the compression stressed part formed thereon, so as to form a relief on the surface of the glass substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.