In-line process for making thin film electronic devices
US7354845B2 · kind B2 · utility
1Cited by
6References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2004 |
| Grant date | Apr 8, 2008 |
| Priority date | — |
| Expiry date | Oct 6, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/12
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An embodiment of the present invention relates to an in-line process for making a thin film electronic device on a substrate. The process includes depositing a structurable layer onto a substrate and depositing photoresist material onto the structurable layer in a first pattern. The process also includes developing the photoresist material, etching the structurable layer in areas uncovered by the photoresist material and removing the remaining photoresist material. The process may be performed without intermediate exposure of the substrate to ambient air.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.