Thermally-enhanced circuit assembly
US7355276B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 10, 2006 |
| Grant date | Apr 8, 2008 |
| Priority date | — |
| Expiry date | Mar 19, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1517
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuit assembly for mounting one or more integrated circuits that effectively dissipates heat generated by the integrated circuits, and a corresponding method for fabricating such a circuit assembly. The circuit assembly comprises a substrate, a thermally-conductive adhesive layer and a heat-dissipating layer. The substrate includes an opening extending between a first surface and a second surface of the substrate. An integrated circuit is to be mounted on the first surface of the substrate substantially coincident with the opening. The thermally-conductive adhesive layer is at least partially disposed within the opening in the substrate. The heat-dissipating layer is disposed on the second surface of the substrate and includes a raised portion that at least partially extends through the opening in the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.