Modular liquid cooling of electronic assemblies
US7355852B2 · kind B2 · utility
58Cited by
38References
30Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 30, 2004 |
| Grant date | Apr 8, 2008 |
| Priority date | — |
| Expiry date | Sep 26, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldIT methods for management
- WIPO sectorElectrical engineering
Abstract
An electronic system includes an array of electronic assemblies at a first location within a system. An array of liquid cooling assemblies is placed at a second location within the system. Hoses or other liquid transport pathways connect the cooling assemblies to the electronic assemblies, for cooling the electronic assemblies. As more electronic assemblies are added to the system, additional cooling assemblies may be provided to manage the increased thermal demands.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.