Module structure and module comprising it
US7355853B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 8, 2002 |
| Grant date | Apr 8, 2008 |
| Priority date | — |
| Expiry date | Sep 13, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09745
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A module is provided that has high reliability in the junction between a ceramic circuit board and a heat sink, undergoes small changes in shape and warp of a module structure comprising a ceramic circuit board and a metal heat sink event under a temperature history during power module assembly and power module actual use, eliminates an unfavorableness during power module assembly, and maintains high reliability over a long period of time. A module structure characterized in that in a module member formed by bonding the ceramic circuit board to the metal heat sink via a metal plate (A) the main component of which is aluminum, the metal plate (A) has a thickness of 400 μm or more and 1,200 μm or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.