Calibration of thermal sensors for semiconductor dies
US7356426B2 · kind B2 · utility
13Cited by
6References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2004 |
| Grant date | Apr 8, 2008 |
| Priority date | — |
| Expiry date | Apr 30, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C2029/5002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A thermal management system is described which may be implemented on a semiconductor die. The system may include a thermal sensor thermally coupled to the die to sense the temperature of the die and generate an output representing the sensed temperature, and an adjustable compensation circuit coupled to the thermal sensor to compensate the thermal sensor output. The adjustable compensation circuit may be applied to the thermal sensor or to a threshold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.