Junction temperature prediction method and apparatus for use in a power conversion module
US7356441B2 · kind B2 · utility
27Cited by
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9Claims
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Key dates
| Filing date | Sep 28, 2005 |
| Grant date | Apr 8, 2008 |
| Priority date | — |
| Expiry date | Apr 24, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02M1/32
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for predicting junction device temperature of at least a first switching device in a power conversion module that includes the first switching device and at least a second switching device, the method comprising the steps of identifying a cross thermal impedance value indicative of how the temperature of the second switching device effects the first switching device temperature an using the cross thermal impedance value to predict the temperature of the at least a first switching device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.