Method of fabricating a high frequency ultrasound transducer
US7356905B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 24, 2005 |
| Grant date | Apr 15, 2008 |
| Priority date | — |
| Expiry date | Apr 18, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53109
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Techniques for fabricating high frequency ultrasound transducers are provided herein. In one embodiment, the fabrication includes depositing a copperclad polyimide film, a layer of epoxy on the copperclad polyimide film, and a polyvinylidene fluoride film on the epoxy. The assembly of materials are then pressed to bond the polyvinylidene fluoride film to the copperclad polyimide film and to form an assembly. The polyvinylidene fluoride film being one surface and the copperclad polyimide film being the other surface. The area behind the copperclad polyimide film surface is filled with a second epoxy, and then cured to form an epoxy plug.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.