Micro-machined structure production using encapsulation

US7356920B2 · kind B2 · utility

Assignee

• Palo Alto Research Center Incorporated · US

Inventors

• Thomas Hantschel · Houtvenne, BE
• Sven Kosgalwies · Dresden, DE
• Eugene M. Chow · Fremont, US
• Gordon Todd Jagerson, Jr. · Menlo Park, US

Key dates

• Filing date: Nov 12, 2004
• Grant date: Apr 15, 2008
• Expiry date: Mar 8, 2026

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/24174
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.