Method for forming a conductive layer pattern
US7356921B2 · kind B2 · utility
12Cited by
10References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 15, 2003 |
| Grant date | Apr 15, 2008 |
| Priority date | — |
| Expiry date | Feb 18, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for forming a conductive layer pattern by selectively depositing droplets containing conductive material onto a porous receiving layer. Much of the conductive material is left on the surface for forming wiring patterns but some of it permeates the pockets or voids in the receiving layer and can be used, for example, to provide interlayer connections in laminated wiring boards. Preferably, the conductive material is provided by fine conductive particles, organometallic compounds or mixtures thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.