Microfluidics packages and methods of using same
US7357898B2 · kind B2 · utility
3Cited by
9References
18Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jul 31, 2003 |
| Grant date | Apr 15, 2008 |
| Priority date | — |
| Expiry date | Mar 31, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T436/2575
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Microfluidics packages and methods of use are described, comprising in one embodiment a substrate having a top surface and means to lower pressure on the top surface; a fluidics card having a bottom surface and means to allow fluids to traverse through the card; and a polymeric barrier film, the polymeric barrier film positioned between the top surface of the substrate and the bottom surface of the fluidics card.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.