Patent · US Expired

Method for thermal development of a photosensitive element using a development medium having a support

US7358026B2 · kind B2 · utility

10Cited by
20References
48Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 15, 2005
Grant dateApr 15, 2008
Priority date
Expiry dateSep 21, 2025

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG03F7/36
  • WIPO fieldTextile and paper machines
  • WIPO sectorMechanical engineering

Abstract

This invention relates to a method for thermally developing a photosensitive element to form a relief pattern. The method includes heating a composition layer of the element to cause a portion of the layer to liquefy and providing a development medium under tension to the element to absorb the liquefied composition. The development medium includes an absorbent material and a support, the combination of which minimizes stretch and distortion of the absorbent material and can impede the migration of the liquefied composition through the absorbent material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.