Method for fabricating microelectromechanical optical display devices
US7358102B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2005 |
| Grant date | Apr 15, 2008 |
| Priority date | — |
| Expiry date | Mar 9, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B26/001
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A Method of forming microelectromechanical optical display devices is provided. A sacrificial layer is formed above a substrate. A plurality of posts penetrating the sacrificial layer is formed. A reflective layer and a flexible layer are sequentially formed above the sacrificial layer and the posts. A photoresist layer is formed on part of the flexible layer. By performing wet etching using the photoresist layer as a mask, a portion of the flexible layer is removed to form a patterned flexible layer. The wet etching is stopped on the reflective layer. The photoresist layer is removed. By performing dry etching using the patterned flexible layer as a mask, a portion of the reflective layer is removed to form a patterned reflective layer. A mechanical layer is formed with the patterned flexible and reflective layers. The sacrificial layer is removed to release the mechanical layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.