Surface emitting laser package having integrated optical element and alignment post
US7358109B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 18, 2004 |
| Grant date | Apr 15, 2008 |
| Priority date | — |
| Expiry date | Oct 29, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/0237
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A package for a surface-emitting laser encloses the die between a sub-mount and a cap. The sub-mount and the cap can be formed using wafer processing techniques that permit a wafer level packaging process which attaches multiple die to a sub-mount wafer, attaches caps either separated or as part of a cap wafer to the sub-mount wafer, and cuts the structure to separate individual packages. The cap includes a transparent plate that can be processed to incorporate an optical element such as a lens. An alignment post attached to the cap indicates the position of an optical signal from the laser and fits snugly into one end of a sleeve while an optical fiber connector fits into the other end.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.