Mounting method of flexible printed circuit and manufacturing method of electric optical device
US7358118B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2005 |
| Grant date | Apr 15, 2008 |
| Priority date | — |
| Expiry date | Oct 2, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1189
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Aspects of the current invention are directed to a method of mounting a flexible printed circuit and a manufacturing method of an electric optical device. Each of the methods form semiconductor elements and first terminal portions for electrically connecting the semiconductor elements and the outside of the board. These terminal portions have are completely or partially covered with an organic film 37 and are pressed into second terminal portion on the flexible printed circuit from the direction above the organic film thereby creating an electrical connection. Optionally, an anisotropic conductive paste or anisotropic conductive film may be provided between the second terminal portion and the organic film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.