Method and system for high-speed precise laser trimming, scan lens system for use therein and electrical device produced thereby
US7358157B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 6, 2005 |
| Grant date | Apr 15, 2008 |
| Priority date | — |
| Expiry date | Apr 20, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/082
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method, system and scan lens system are provided for high-speed, laser-based, precise laser trimming at least one electrical element. The method includes generating a pulsed laser output having one or more laser pulses at a repetition rate. Each laser pulse has a pulse energy, a laser wavelength within a range of laser wavelengths, and a pulse duration. The method further includes selectively irradiating the at least one electrical element with the one or more laser pulses focused into at least one spot having a non-uniform intensity profile along a direction and a spot diameter as small as about 6 microns to about 15 microns so as to cause the one or more laser pulses to selectively remove material from the at least one element and laser trim the at least one element while avoiding substantial microcracking within the at least one element. The wavelength is short enough to produce desired short-wavelength benefits of small spot size, tight tolerance and high absorption, but not so short so as to cause microcracking.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.