Backing, transducer array and method for thermal survival
US7358645B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 19, 2004 |
| Grant date | Apr 15, 2008 |
| Priority date | — |
| Expiry date | Jul 28, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Backing blocks, transducer arrays and methods are provided for thermal cycle survivability. By decoupling a portion of the backing block from a case used to contain the transducer stack, the greater thermal expansion properties of most backing blocks may be minimized. For example, a rim is formed on the backing block material. The rim is bonded to the case structure while other portions of the backing block remain free of bonding to the case structure. During thermal cycling or other temperature changes, the backing block may be less likely to expand or bulge and crack, delaminate or damage transducer elements or other transducer materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.