Organic electronic device provided with a metallic heat sink structure
US7358665B2 · kind B2 · utility
7Cited by
8References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2004 |
| Grant date | Apr 15, 2008 |
| Priority date | — |
| Expiry date | Nov 30, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/858
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An aspect of the present invention provides an organic electronic device includes a heat sink having a side with a roughened surface and/or a black surface and a process for forming devices having such heat sinks including forming a patterned electrically conductive layer includes an electrically conductive member. The process includes selectively forming spaced-apart members. The heat sink includes the spaced-apart members, which are spaced apart from each other and thermally coupled to the electrically conductive member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.