Laser triangulation method for measurement of highly reflective solder balls
US7359068B2 · kind B2 · utility
6Cited by
4References
52Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 14, 2005 |
| Grant date | Apr 15, 2008 |
| Priority date | — |
| Expiry date | Nov 14, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B11/0608
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system and method of determining a height and/or position of at least one element on an area array device. A laser beam scans the area array device using at least two different laser light intensities. Reflected light is sampled, and the height and/or position of the element is determined using, e.g., optical triangulation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.