Overmold component seal in an electronic device housing
US7359144B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2005 |
| Grant date | Apr 15, 2008 |
| Priority date | — |
| Expiry date | Aug 10, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B33/1466
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In general, the invention is directed to techniques for forming a seal between parts of an overmold component. The overmold component includes a first part forming one or more thorough-holes and a second part overmolded to the first part. A through-hole may be, for example, a screw hole or an overmold material entrance hole. The through-holes formed by the first part are surrounded by an adhesive prior to overmolding the second part. After overmolding, the adhesive locally bonds the surface of the first part to the overmold part to make a seal around the through holes. For example, the overmold component may combine with a cover to form a housing of a disc drive or other electronic device defining an internal environment. In this example, the adhesive prevents external contaminants from entering the internal environment via the through-holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.