Method of manufacturing microchannel heat exchangers
US7360309B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 28, 2004 |
| Grant date | Apr 22, 2008 |
| Priority date | — |
| Expiry date | Feb 12, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49359
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat exchanger device includes an extruded body that includes one or more layers of channels for coolant flow therethrough, the channels generally having inner diameters of between about 50 microns to about 2000 microns. The device is formed of a material having a high thermal conductivity to facilitate transfer of heat from the heating components present in the subject cooling application to the coolant passing through the heat exchanger and to be compatible with materials of the heating components. The device material is selected from the group consisting of ceramic oxides, ceramic carbides, ceramic nitrides, ceramic borides, ceramic silicides, metals, and intermetallics, and combinations thereof. The heat exchanger device is formed from an extruded filament that is arranged to give the desired channel configuration. The filament includes a central, removable material and an outer material that forms the channel walls upon removal of the central material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.