Integrated liquid cooling system for electronic components
US7360583B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2006 |
| Grant date | Apr 22, 2008 |
| Priority date | — |
| Expiry date | Aug 4, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
An integrated liquid cooling system (100) includes a pump (10), a mounting base (15), a heat dissipating member (20). The mounting base defines therein a through hole (151). The heat dissipating member is mounted to and maintained in fluid communication with the mounting base. The pump is received in the through hole of the mounting base. The pump has a bottom plate for thermally contacting a heat generating component and is configured for driving a coolant to circulate through the mounting base and the heat dissipating member. The pump, the mounting base and the heat dissipating member of the liquid cooling system are combined together to form an integrated and compact structure without utilizing any connecting pipes or fittings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.