Apparatus and method for the mechanical comminution of semiconductor materials

US7360727B2 · kind B2 · utility

Assignee

• Wacker Chemie AG · DE

Inventors

• Matthaeus Schantz · Simbach, DE
• Peter Gruebl · Triftern, DE
• Hanns Wochner · Burghausen, DE

Key dates

• Filing date: Apr 25, 2006
• Grant date: Apr 22, 2008
• Expiry date: May 13, 2026

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C01B33/02
• WIPO field: Materials, metallurgy
• WIPO sector: Chemistry

Abstract

A mechanical crushing apparatus for comminuting a polycrystalline silicon ingot, has a base and opposed comminuting and mating chisels, the chisels having longitudinal axises oriented at right angles to a longitudinal axis of the base and parallel to the surface of the base, and being movable in such a manner that a silicon ingot to be comminuted and which rests on the surface of the base can be positioned between the chisels such that all the chisels in the region of the silicon ingot are in contact with the silicon ingot, and comminution chisels in front of and behind the silicon ingot can be moved in the direction of their longitudinal axis to within a safety distance of the respective mating chisel, and the comminution chisels act on and break up the silicon ingot by means of sudden movement(s) in the direction of their longitudinal axes.