RFID label technique
US7361251B2 · kind B2 · utility
23Cited by
142References
63Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2005 |
| Grant date | Apr 22, 2008 |
| Priority date | — |
| Expiry date | Jun 24, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1097
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An RFID webstock containing a relatively high pitch-density array of semiconductive chips is provided and joined to a web bearing relatively widely spaced antennas in a continuous process. The RFID webstock is separated or cut into individual chip sections, with the spacing of the chips being increased as the RFID webstock is die cut. The individual chips on the sections are then joined to corresponding antennas to form an RFID inlay stock. This process is conducive to high speed roll-to-roll production of RFID tag and label roll stock.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.