Compositions for the removal of organic and inorganic residues
US7361631B2 · kind B2 · utility
7Cited by
10References
10Claims
0Family size
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Key dates
| Filing date | Sep 15, 2004 |
| Grant date | Apr 22, 2008 |
| Priority date | — |
| Expiry date | Feb 14, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/0381
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A composition and method using same for removing photoresist and/or processing residue from a substrate are described herein. In one aspect, there is provided a composition for removing residue consisting essentially of: an acidic buffer solution having an acid selected from a carboxylic acid or a polybasic acid and an ammonium salt of the acid in a molar ratio of acid to ammonium salt ranging from 10:1 to 1:10; an organic polar solvent that is miscible in all proportions in water; a fluoride, and water wherein the composition has a pH ranging from about 3 to about 7.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.